We are proud to announce issuance of US Patent #8,860,594, a technological breakthrough which enables 4x to 8x bandwidth increases over reduced wiring, breaking the I/O bottleneck that impedes the growth of high-bandwidth interconnections. For decades we have seen on-chip capability grow at or near the curve known as "Moore's Law", while I/O capabilities languished due to the physical limits of I/O pad size and digital signaling. Please download and read our White Paper titled "Breaking The I/O Bottleneck" describing the breakthrough. Contact us for more information.
We have entered into licensing discussions with several companies. If you or your company is interested in licensing this technology please contact us using the addresses provided on the contact us page.